Application

Non-Destructive Testing

Non-contact ultrasonic imaging. See bond quality, defects, and sub-micron thickness variations — no couplant, no gel, no touching the surface.

5 MHz

Bandwidth

100 μm

Resolution

Zero Couplant

Non-contact, air-coupled

BROADSONIC optical ultrasonic sensor

The Problem

Some Things Can’t Be Touched During Inspection

Hot parts. Moving surfaces. Delicate materials. Sterile environments. Conventional ultrasonic NDT requires couplant — gel, water, or direct contact — that is impractical or impossible in many high-value inspection scenarios.

Couplant-Free

No gel, no water tank, no contact. Inspect through air at standoff distance.

0–5 MHz Bandwidth

Full broadband capture at every scan point. Reconstruct images at any frequency in post-processing.

100 μm Resolution

Point-sensor optical detection. Resolve fine structural features that larger sensors average out.

Capability

Sub-Micron Thickness Mapping

Zero-group-velocity (ZGV) Lamb wave resonances map directly to local plate thickness. BROADSONIC excites these modes and measures their frequency at each scan point, constructing a full-field thickness map with sub-micron sensitivity — completely non-contact. Published measurements on aluminum, glass, and stainless-steel plates demonstrate ZGV resonance quality factors of Q ~ 104, with thickness-range coverage from ~1–10 mm and high-SNR data extracted in well under 1 second.[1]

Measured Result

We scanned a standard microscope slide and measured a 7.4 μm thickness wedge across 20 mm — a 1.3 arcminute tilt, completely invisible to contact methods. The underlying S1-ZGV resonance for the ~1 mm slide was observed at ~2.81 MHz, in excellent agreement with theoretical predictions.[1] Explore the real data below.

Where This Matters

  • Display glass — flatness verification (published data on microscope slides)
  • Composite layups — ply thickness and uniformity
  • Semiconductor wafers — thickness uniformity across the wafer
  • Battery electrodes — coating thickness consistency

If your process assumes “flat,” you might want to check.

See It In Action

Scanning a Glass Slide for Sub-Micron Thickness Variation

BROADSONIC scans a standard microscope slide point-by-point, exciting ZGV Lamb wave resonances at each position. The resulting thickness map reveals a 7.4 μm wedge across 20 mm — completely invisible to contact methods.

Capability

Adhesive Bond & Contact Inspection

Kissing bonds and partial adhesion are invisible to visual inspection, but they are the root cause of field failures in composites, electronics, and medical devices. BROADSONIC scans reveal the actual contact area — not what the surface looks like, but where acoustic energy is actually transmitted. A published c-scan demonstrated imaging of an adhered tape feature on a glass slide using this same ZGV transmission approach.[1]

What We’ve Demonstrated

Wall tape on a microscope slide — what looks like a simple rectangle to the naked eye reveals edge adhesion, air pockets, and pressure variation. All measured non-contact, from above.

What you see What BROADSONIC sees
Amplitude map showing bond quality
Visible light photograph of tape on glass
Peak frequency map revealing tape adhesion pattern
2.70 2.75 2.80 2.85 2.90
Frequency (MHz)
Peak amplitude map showing signal attenuation from tape contact
0 5 10 15 20
Amplitude (dB)

Applications

  • Adhesive bond quality verification in composites and laminates
  • Spot weld inspection — surface fusion vs. actual joint strength
  • Delamination detection in multi-layer structures
  • Seal integrity in packaging and medical devices

Advantage

Why Non-Contact Changes Everything

Hot Parts

Inspect components at elevated temperatures where couplant evaporates or contact sensors fail.

Delicate Surfaces

Thin films, coatings, and fragile substrates that cannot tolerate physical contact or fluid.

Inline Automation

No couplant application or cleanup. Complete vibrational spectra of mm-scale objects captured in sub-second timescales with SNR up to ~1000.[2]

Sterile & Clean Environments

Medical device manufacturing and semiconductor fabs where contamination from gel or water is unacceptable.

How BROADSONIC Compares for NDT

Conventional Contact Ultrasound

Requires couplant (gel or water) and physical contact. Cannot inspect hot, moving, or delicate parts. Energy loss at a single air–steel interface is ~45 dB, totalling over 80 dB for through-transmission — making non-contact inspection of metals one of the most challenging problems in ultrasonics.[1] BROADSONIC overcomes this entirely through air, delivering high-SNR ZGV transmission data in well under 1 second.[1]

Laser Ultrasonics (Generation + Detection)

High resolution but extremely expensive ($200K+ systems). Generation laser can damage sensitive surfaces. Published comparisons show that BROADSONIC’s air-jet source and optomechanical receiver achieve equal or better SNR for steel plate measurements — without high-energy pulsed lasers or high-voltage transmit electronics.[1]

Other Air-Coupled Transducers

Conventional air-coupled sensors are narrowband (typically tuned to a single frequency) and have relatively large apertures that limit spatial resolution.[1] BROADSONIC captures 0–5 MHz in a single pass with a ~100 μm diameter point sensor.[1]

Industries

Who Needs This

Aerospace & Composites

Bond inspection, delamination detection, and ply thickness verification in composite structures.

Automotive

Spot weld inspection and adhesive bond verification in body-in-white and battery assembly.

Semiconductors & Electronics

Wafer thickness uniformity, thin-film metrology, and die-attach inspection with no contamination risk.

Medical Devices

Seal integrity, bond verification, and component inspection in sterile manufacturing environments.

Measurement Capabilities

Detection Bandwidth 0–5 MHz, broadband, single pass[1]
Spatial Resolution Down to 0.1 mm (100 μm)
Contact None — air-coupled, no couplant
Thickness Sensitivity Sub-micron (demonstrated 7.4 μm over 20 mm)[1]
Imaging Modes C-scan, frequency-selective amplitude maps, ZGV resonance maps
Standoff / Working Distance mm to few cm (non-contact, air-coupled)
EMI Immunity Complete — fully optical sensor head

Supporting Research

[1] Non-Contact Characterization of Plates Using a Turbulent Air-Jet Source and an Ultrasound Microphone

Pretula, Shaw, DeCorby, Chen, Scheuer & DeCorby · MDPI NDT · 2026

Download PDF →

[2] Resonant Ultrasound Spectroscopy Detection Using a Non-Contact Ultrasound Microphone

Pretula, Shaw, Chen, Scheuer & DeCorby · MDPI Sensors · 2025

Download PDF →

[3] Air-Coupled Ultrasound Using Broadband Shock Waves from Piezoelectric Spark Igniters

Scheuer & DeCorby · Applied Physics Letters · 2024

Download PDF →

Working With Composites, Thin Materials, or Automation?

We’d love to hear what inspection challenges you’re running into. Let’s talk about whether non-contact ultrasonic imaging can solve them.